Company Filing History:
3 out of 35 
3 out of 27 Years Active: 2024-2025
Title: Cheng Lv: Innovator in Molecular Sieve Technology
Introduction
Cheng Lv is a prominent inventor based in Tianjin, China, known for his significant contributions to the field of molecular sieve technology. With a total of 3 patents, he has developed innovative methods that enhance the efficiency and effectiveness of molecular sieves in various applications.
Latest Patents
One of Cheng Lv's latest patents is titled "Synthesis method for directly preparing H-type molecular sieve having CHA framework type and use thereof." This invention describes a hydrothermal synthesis process that utilizes specific compounds as structure-directing agents to create H-type molecular sieves with a CHA framework. The method allows for the production of molecular sieves with high relative crystallinity, making it suitable for large-scale production. Another notable patent is "MSECT-4 molecular sieves with OFF and ERI topologies, preparation method therefor, and applications thereof." This patent outlines a preparation method for msect-4 molecular sieves, which exhibit excellent hydrothermal stability and a large specific surface area, making them applicable in various technical fields.
Career Highlights
Cheng Lv has worked with notable organizations such as the China Automotive Technology and Research Center Co. Ltd and the Catarc Automotive Test Center (Tianjin) Co., Ltd. His work in these institutions has allowed him to apply his innovative ideas in practical settings, contributing to advancements in automotive technology and materials science.
Collaborations
Cheng has collaborated with several professionals in his field, including Kaixiang Li and Zhenguo Li. These collaborations have fostered a productive environment for innovation and research, leading to the development of cutting-edge technologies.
Conclusion
Cheng Lv's work in molecular sieve technology showcases his dedication to innovation and excellence. His patents reflect a commitment to advancing the field and improving industrial applications.