This inventor holds 1 USPTO granted patent. Top assignee: Realtek Semiconductor Inc.. Active years: 2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2018
Title: Cheng-Lin Wu and Printed Circuit Board Interconnect Design.
Introduction
Cheng-Lin Wu is an inventor associated with Kaohsiung, Taiwan, and Realtek Semiconductor Inc. His patent work includes a design for a ball grid array formed on a printed circuit board.
Latest Patents
Wu is credited with 1 patent: “Ball Grid Array Formed on Printed Circuit Board.” The invention describes two solder-ball modules. In the first module, a grounded solder ball shields two other solder balls, while another ball is floating. In the second module, two solder balls are grounded, and one connects through a plated through hole in the printed circuit board to shield two balls in the first module. The arrangement addresses shielding within a board-level interconnect.
Career Highlights
Wu’s listed patent reflects work on printed circuit board and ball grid array design. The patent record identifies Realtek Semiconductor Inc. as his company affiliation.
Collaborations
Chin-Yuan Lo and Ting-Ying Wu are listed as Wu’s coworkers.
Conclusion
Cheng-Lin Wu’s patent describes a solder-ball arrangement that uses grounding and a plated through hole to provide shielding in a printed circuit board assembly.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile