This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2019.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2019
Title: Innovations by Cheng-Liang Cho in Package Structures
Introduction
Cheng-Liang Cho is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative patent related to package structures.
Latest Patents
Cheng-Liang Cho holds a patent titled "Method for forming package structure including intermetallic compound." This patent describes a package structure that includes a package component with a first bump and an intermetallic compound (IMC) on that bump. The structure also features an integrated circuit die with a second bump on the IMC. The bonding between the integrated circuit die and the package component is achieved through these bumps, ensuring robust physical and electrical connections.
Career Highlights
Cheng-Liang Cho is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on enhancing the reliability and performance of package structures, which are crucial for modern electronic devices.
Collaborations
Cheng-Liang has collaborated with esteemed colleagues such as Heng-Chi Huang and Chien-Chen Li. Their combined expertise contributes to the advancement of semiconductor technologies.
Conclusion
Cheng-Liang Cho's innovative work in package structures exemplifies the importance of advancements in semiconductor technology. His contributions continue to influence the industry and pave the way for future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile