Company Filing History:
Years Active: 2019
Title: Innovations by Cheng-Liang Cho in Package Structures
Introduction
Cheng-Liang Cho is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative patent related to package structures.
Latest Patents
Cheng-Liang Cho holds a patent titled "Method for forming package structure including intermetallic compound." This patent describes a package structure that includes a package component with a first bump and an intermetallic compound (IMC) on that bump. The structure also features an integrated circuit die with a second bump on the IMC. The bonding between the integrated circuit die and the package component is achieved through these bumps, ensuring robust physical and electrical connections.
Career Highlights
Cheng-Liang Cho is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on enhancing the reliability and performance of package structures, which are crucial for modern electronic devices.
Collaborations
Cheng-Liang has collaborated with esteemed colleagues such as Heng-Chi Huang and Chien-Chen Li. Their combined expertise contributes to the advancement of semiconductor technologies.
Conclusion
Cheng-Liang Cho's innovative work in package structures exemplifies the importance of advancements in semiconductor technology. His contributions continue to influence the industry and pave the way for future innovations.