Company Filing History:
Years Active: 2016
Title: Innovations by Cheng Kuo Cheng in Bonding Stress Testing
Introduction
Cheng Kuo Cheng is an accomplished inventor based in Singapore, known for his contributions to the field of bonding stress testing. With a focus on developing innovative solutions, he has secured a patent that enhances the understanding of stress in bonding areas.
Latest Patents
Cheng Kuo Cheng holds a patent for a "Bonding stress testing arrangement and method of determining stress." This invention provides a bonding stress testing arrangement that includes at least one bond pad and a sensor assembly. The sensor assembly comprises a first sensor arrangement, a second sensor arrangement, or a combination of both. The first sensor arrangement is designed to measure the average stress on a portion of the bonding area under the bond pad, while the second sensor arrangement determines the stress distribution over a portion or the entire bonding area.
Career Highlights
Cheng Kuo Cheng is affiliated with the Agency for Science, Technology and Research, where he applies his expertise in developing advanced testing methods. His work has significantly contributed to the understanding of bonding stress, which is crucial in various engineering applications.
Collaborations
Cheng collaborates with talented individuals such as Cheryl Sharmani Selvanayagam and Xiaowu Zhang, enhancing the innovative environment in which he works.
Conclusion
Cheng Kuo Cheng's innovative approach to bonding stress testing exemplifies the importance of research and development in engineering. His contributions are paving the way for advancements in stress measurement techniques.