The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2016
Filed:
May. 03, 2011
Cheryl Sharmani Selvanayagam, Singapore, SG;
Xiaowu Zhang, Singapore, SG;
Tai Chong Chai, Singapore, SG;
Alastair David Trigg, Singapore, SG;
Cheng Kuo Cheng, Singapore, SG;
Xian Tong Chen, Singapore, SG;
Kripesh Vaidyanathan, Singapore, SG;
Cheryl Sharmani Selvanayagam, Singapore, SG;
Xiaowu Zhang, Singapore, SG;
Tai Chong Chai, Singapore, SG;
Alastair David Trigg, Singapore, SG;
Cheng Kuo Cheng, Singapore, SG;
Xian Tong Chen, Singapore, SG;
Kripesh Vaidyanathan, Singapore, SG;
Agency for Science, Technology and Research, Singapore, SG;
Abstract
A bonding stress testing arrangement and a method of determining stress are provided. The bonding stress testing arrangement includes at least one bond pad; a sensor assembly comprising any one of a first sensor arrangement, a second sensor arrangement and a combination of the first sensor arrangement and the second sensor arrangement; wherein the first sensor arrangement is adapted to measure an average stress on a portion of a bonding area under the at least one bond pad, and the second sensor arrangement is adapted to determine stress distribution over a portion or an entire of the bonding area under the at least one bond pad.