Cheng-Jun Yang

Title: Cheng-Jun Yang: Innovator in Contact Area Structures

Introduction

Cheng-Jun Yang is a notable inventor based in Kaili, China. He has made significant contributions to the field of contact area structures, particularly through his innovative patent. His work focuses on enhancing the adhesive strength between conductive layers, which is crucial for various electronic applications.

Latest Patents

Cheng-Jun Yang holds a patent for a contact area structure that includes an organic adhesive layer positioned between an inorganic conductive layer and a transparent conductive layer. This invention features an organic substrate with at least one contact pad area, which consists of a first block and a second block adjacent to the first block. The inorganic conductive layer is strategically placed on the organic substrate, partially covering the first block while leaving a portion of the upper surface of the organic substrate exposed at the second block. The organic adhesive layer covers both the inorganic conductive layer and the upper surface of the organic substrate, enhancing the adhesive strength between the transparent conductive layer and the inorganic conductive layer.

Career Highlights

Cheng-Jun Yang is associated with Tpk Advanced Solutions Inc., where he continues to develop innovative solutions in the field of electronics. His expertise in contact area structures has positioned him as a valuable asset to his company and the industry at large.

Collaborations

Cheng-Jun Yang has collaborated with notable colleagues, including Chia-Jui Lin and Kuo-Lung Fang. These partnerships have contributed to the advancement of technology in their respective fields.

Conclusion

Cheng-Jun Yang's contributions to the field of contact area structures demonstrate his innovative spirit and commitment to enhancing electronic technologies. His patent reflects a significant advancement in the industry, showcasing the importance of collaboration and creativity in driving innovation forward.