Company Filing History:
Years Active: 2020-2021
Title: **Innovations by Cheng-Hung Ko: A Pioneer in Semiconductor Packaging**
Introduction
Cheng-Hung Ko, an accomplished inventor based in Kaohsiung, Taiwan, is recognized for his significant contributions to the field of semiconductor technology. With a total of two patents to his name, Ko has demonstrated a keen inventiveness that addresses key challenges in semiconductor packaging.
Latest Patents
One of Cheng-Hung Ko's latest patents is titled "Semiconductor device package and method of manufacturing the same." This innovative package comprises a metal carrier with two conductive pads that define a space in between. A passive device is installed on the surfaces of these conductive pads, while conductive adhesive materials connect it to the pads, ensuring electrical connectivity. The design incorporates a dielectric layer that covers the carrier and passive device, exposing specific surfaces for optimal performance. Additionally, a conductive via is embedded within the dielectric layer, establishing electrical connections crucial for the device's functionality.
Career Highlights
Cheng-Hung Ko is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to engage in groundbreaking work within the semiconductor industry. His focus on innovative packaging solutions reflects his commitment to enhancing the efficiency and reliability of semiconductor devices.
Collaborations
Throughout his career, Ko has collaborated with talented colleagues such as Hui Hua Lee and Hui-Ying Hsieh. These partnerships have fostered an environment of innovation, enabling the team to explore and develop advanced semiconductor technologies together.
Conclusion
Cheng-Hung Ko's work is a testament to the importance of innovation in the semiconductor sector. His patents not only contribute to advancements in technology but also demonstrate his role as a key inventor in the industry. As he continues to evolve his ideas and collaborate with others, Ko's impact on semiconductor packaging is bound to grow, paving the way for future innovations.