Cheng-Hui Lee

Title: Innovations by Cheng-Hui Lee in Chip Scale Packaging

Introduction

Cheng-Hui Lee is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative chip scale packaging method. His work has implications for the efficiency and effectiveness of semiconductor devices.

Latest Patents

Cheng-Hui Lee holds 1 patent for his chip scale packaging method. This method involves packaging a single-sided substrate along with one or more semiconductor chips. The process includes stenciling nonconductive surfaces of the substrate to create chip-implanting adhesive areas, which are equipped with through holes. The chips are implanted in these adhesive areas, ensuring that the active surfaces are in contact with the adhesive. After implantation, the substrate and chips are heated under pressure, allowing for the bonding pads to connect with the conductive surface of the substrate using metal bonding wires. The final steps include applying a passivation layer and implanting spherical bonding points in a grid array fashion.

Career Highlights

Cheng-Hui Lee has been associated with United Test Center Inc., where he has further developed his expertise in semiconductor technologies. His innovative approach to chip packaging has positioned him as a key figure in the industry.

Collaborations

Cheng-Hui Lee has worked alongside notable colleagues such as Kuo-Teh Ho and Chong-Ren Maa. Their collaborative efforts have contributed to advancements in semiconductor packaging techniques.

Conclusion

Cheng-Hui Lee's contributions to chip scale packaging represent a significant advancement in semiconductor technology. His innovative methods continue to influence the industry and enhance the performance of electronic devices.