Company Filing History:
Years Active: 2018-2019
Title: Cheng-Huang Lee: Innovator in Heat Dissipation Technology
Introduction
Cheng-Huang Lee is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronic devices, particularly in heat dissipation technology. With a total of 2 patents to his name, Lee continues to push the boundaries of innovation in his industry.
Latest Patents
Lee's latest patents include a heat dissipation module and an electronic device having the same. The heat dissipation module features a base, a frame, and a positioning member. The frame is positioned on the base and contains a passage for an electronic component. Notably, a segment of the edge of the frame adjacent to the base is designed to create an air path inlet that communicates with the passage. The positioning member is located within the passage and is connected to the frame, serving to position an electronic assembly securely.
Another significant patent is for an electronic device and case assembling method. This electronic device comprises a supporting member, a case, at least two positioning structures, a guiding structure, and a protrusion. The positioning structures are strategically placed on both the supporting member and the case to facilitate their assembly. The guiding structure on the supporting member aids in the assembly process, while the protrusion on the case is guided by this structure, simplifying the assembly and enhancing efficiency.
Career Highlights
Cheng-Huang Lee is currently associated with Synology Inc., a company known for its innovative solutions in data storage and management. His work at Synology has allowed him to apply his inventive skills to develop cutting-edge technologies that address the needs of modern electronic devices.
Conclusion
Cheng-Huang Lee is a notable inventor whose work in heat dissipation technology has made a significant impact in the electronics field. His innovative patents reflect his commitment to improving electronic device efficiency and assembly processes.