Synology Inc.

Cheng-Huang Lee

A heat dissipation module is provided. The heat dissipation includes a base, a frame, and a positioning member. The frame is disposed on the base and has a passage for containing an electronic component. At least a segment of the edge of the frame that is adjacent to the base is distant from the base so as to form an air path inlet that communicates with the passage therebetween. The positioning member is disposed in the passage and is connected to the frame and configured to position an electronic assembly in the frame.

Heat dissipation module and electronic device having the same

An electronic device is provided. The electronic device includes a supporting member, a case, at least two positioning structures, a guiding structure, and a protrusion. The two positioning structures are respectively disposed on the supporting member and the case, and are configured to facilitate assembly of the case and the supporting member. The guiding structure is disposed on the supporting member. The protrusion is disposed on the case. The protrusion is guided by the guiding structure so as to simplify the assembly process and improve the efficiency of assembly.

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Taipei, Taiwan

Cheng-Huang Lee