This inventor holds 5 USPTO granted patents. Top assignee: Oracle International Corporation. Active years: 2008-2019.
Company Filing History:
Years Active: 2008-2019
Title: Innovations of Cheng-Hua Wang
Introduction
Cheng-Hua Wang is a notable inventor based in Bedford, NH (US). He has made significant contributions to the field of technology, particularly in the areas of point cloud data processing and network modeling. With a total of 5 patents to his name, Wang continues to push the boundaries of innovation.
Latest Patents
One of his latest patents is titled "System and method providing a scalable and efficient space filling curve approach to point cloud feature generation." This invention focuses on identifying features within point cloud data by transforming coordinates into space-filling distance values. The points are then sorted and traversed to derive output data points that identify features within the point cloud.
Another significant patent is the "Aggregated network model with component network aggregation." This patent describes a method for modeling an aggregated network by storing sets of nodes and links associated with multiple networks. It also includes transfer links that connect nodes across different networks, enhancing the understanding of complex network interactions.
Career Highlights
Cheng-Hua Wang is currently employed at Oracle International Corporation, where he applies his expertise in technology and innovation. His work has been instrumental in developing advanced systems that improve data processing and network modeling.
Collaborations
Wang collaborates with talented individuals such as Siva Ravada and Huiling Gong, contributing to a dynamic work environment that fosters innovation and creativity.
Conclusion
Cheng-Hua Wang's contributions to technology through his patents and work at Oracle International Corporation highlight his role as a leading inventor in his field. His innovative approaches to point cloud data and network modeling continue to influence advancements in technology.
