Company Filing History:
3 out of 5 
1 out of 1 
8 out of 833,002 Years Active: 2003-2006
Title: Innovations of Cheng-Hua Cheng
Introduction
Cheng-Hua Cheng is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of heat dissipation technology, holding a total of 9 patents. His work focuses on enhancing the efficiency of electronic devices through innovative cooling solutions.
Latest Patents
One of Cheng's latest patents is a water-cooling heat dissipation system. This system includes a heat sink mounted on a heat-generating electronic device and a circulating loop connected to both ends of the heat sink. The circulating loop features a water pump at the inlet of the heat sink, a first cooling base at the outlet, and a second cooling base positioned between the water pump and the heat sink. The second cooling base incorporates a cryogenic chip that provides icy water to the heat sink, significantly improving heat dissipation efficiency. Another recent patent is a heat dissipating device with an improved fastening structure. This fastening structure is designed to secure a heat dissipating device to a printed circuit board, which contains multiple holes. The structure includes a back plate located beneath the printed circuit board and several fitting columns. Each fitting column consists of an elongate hollow tube with a threaded internal sidewall and an insertion member that conforms to the respective holes, ensuring a secure attachment.
Career Highlights
Cheng-Hua Cheng has worked with various companies, including Waffer Technology Corporation. His experience in the industry has allowed him to develop and refine his innovative ideas, leading to the successful patenting of his inventions.
Collaborations
Cheng has collaborated with notable individuals in his field, including Jack Wang and Michael Lin. These partnerships have contributed to the advancement of his projects and the successful implementation of his inventions.
Conclusion
Cheng-Hua Cheng is a prominent inventor whose work in heat dissipation technology has led to significant advancements in electronic device efficiency. His innovative patents and collaborations highlight his contributions to the field.