Company Filing History:
Years Active: 2017
Title: Cheng-Hao Ciou: Innovator in Semiconductor Packaging
Introduction
Cheng-Hao Ciou is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on enhancing the structural integrity and functionality of semiconductor packages.
Latest Patents
Cheng-Hao Ciou's latest patents include a novel fabrication method for semiconductor packages. This invention features an insulating base body with an opening, an insulating extending body, and an electronic element positioned within the opening. The design aims to improve the overall structural rigidity of the package, ensuring better performance and reliability. His second patent also revolves around a similar concept, emphasizing the importance of the insulating layer configuration in enhancing package strength.
Career Highlights
Cheng-Hao Ciou is currently employed at Siliconware Precision Industries Co., Ltd. His role at the company allows him to apply his innovative ideas in practical applications, contributing to advancements in semiconductor technology.
Collaborations
Cheng-Hao has collaborated with notable coworkers, including Ching-Wen Chiang and Cheng-Chieh Wu. Their teamwork has fostered an environment of innovation and creativity within their projects.
Conclusion
Cheng-Hao Ciou's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in technology. His patents reflect a deep understanding of the complexities involved in semiconductor design, paving the way for future advancements in the industry.