Taipei, Taiwan

Cheng-Feng Liao

This inventor holds 7 USPTO granted patents and 3 published patent applications and 1 EPO patent. Top assignee: Hewlett-Packard Development Company, L.p.. Active years: 2019-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng-Feng Liao. Retrieved from https://idiyas.com/inventor/cheng-feng-liao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7 

% Patents Active = 28.6

 

Average Co-Inventor Count = 3.9

ph-index = 1

Forward Citations = 10(Granted Patents)


Location History:

  • Taipei, TW (2019 - 2021)
  • Taipei, CN (2022)

Company Filing History:


Years Active: 2019-2022

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7 patents (USPTO):Explore Patents

Title: Innovations of Cheng-Feng Liao in Wi-Fi Technology and Metal Composites

Introduction

Cheng-Feng Liao, an accomplished inventor based in Taipei, Taiwan, has made significant contributions to technology, holding a total of seven patents. His innovations have primarily focused on enhancing communication systems, specifically in reducing Wi-Fi signal degradation, as well as advancements in composite materials.

Latest Patents

Cheng-Feng Liao's recent innovations include a groundbreaking system aimed at reducing degradation of Wi-Fi signals for computers. This invention features a dual-antenna setup within a computer, strategically positioned to avoid simultaneous signal blockage caused by user interaction, such as typing. By placing one antenna in a different region from the other, the system ensures uninterrupted Wi-Fi connectivity.

Another notable patent by Liao involves the formation of metal composites, showcasing a sophisticated method of shaping materials. In this invention, a metal sheet is formed into a desired shape utilizing superplastic thermal forming techniques. In conjunction, a carbon fiber-reinforced polymer sheet is shaped and bonded with the metal sheet using adhesive, resulting in a high-performance metal composite.

Career Highlights

Cheng-Feng Liao is affiliated with Hewlett-Packard Development Company, L.P., where he applies his expertise in innovative technologies. His extensive experience in the field of inventions has not only led to his individual patents but also contributed to the technological advancement of the company.

Collaborations

Throughout his career, Liao has collaborated with talented colleagues, including Kuan-Ting Wu and Wei-Chung Chen. Their combined efforts in the field of technology have fostered an environment of creativity and innovation, resulting in impactful inventions and patents.

Conclusion

Cheng-Feng Liao's innovative spirit and technical expertise are evident in his impressive portfolio of patents. His contributions in reducing Wi-Fi signal degradation and advancing metal composite formation highlight his dedication to enhancing technology. With a solid foundation at Hewlett-Packard Development Company and collaborative efforts with skilled coworkers, Liao continues to be a driving force in the landscape of modern innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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