This inventor holds 1 USPTO granted patent. Top assignee: Precision Instrument Development Center National Science Council. Active years: 2002.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002
Title: Cheng-Chung Lee: Innovator in Thermal Expansion Measurement
Introduction
Cheng-Chung Lee is a notable inventor based in Chung-Li, Taiwan. He has made significant contributions to the field of precision measurement, particularly in the area of thermal expansion coefficients of thin films. His innovative approach has garnered attention in the scientific community.
Latest Patents
Cheng-Chung Lee holds a patent for a "Method for measuring a thermal expansion coefficient of a thin film by using phase shifting interferometry." This patent showcases his expertise in utilizing advanced techniques to enhance measurement accuracy.
Career Highlights
Lee is affiliated with the Precision Instrument Development Center under the National Science Council. His work at this institution has allowed him to focus on developing cutting-edge measurement technologies that benefit various scientific applications.
Collaborations
Throughout his career, Cheng-Chung Lee has collaborated with esteemed colleagues, including Cheng-Chung Jaing and Chuen-Lin Tien. These partnerships have fostered a collaborative environment that promotes innovation and research advancement.
Conclusion
Cheng-Chung Lee's contributions to the field of thermal expansion measurement exemplify his dedication to innovation and precision. His work continues to influence the scientific community and pave the way for future advancements in measurement technologies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile