Company Filing History:
Years Active: 2017
Title: Innovations by Cheng-Chieh Wu in Semiconductor Packaging
Introduction
Cheng-Chieh Wu is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that enhance the structural integrity and functionality of semiconductor devices.
Latest Patents
Wu's latest patents include a fabrication method of a semiconductor package. This innovative package features an insulating base body with an opening, an insulating extending body, and an electronic element positioned within the opening. The design incorporates a dielectric layer and a circuit layer, which are crucial for improving the overall structural rigidity of the package. His work on semiconductor packages emphasizes the importance of robust design in electronic components.
Career Highlights
Cheng-Chieh Wu is currently employed at Siliconware Precision Industries Co., Ltd. His role at this leading company allows him to apply his expertise in semiconductor technology and contribute to advancements in the industry.
Collaborations
Wu has collaborated with talented coworkers, including Ching-Wen Chiang and Cheng-Hao Ciou. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Cheng-Chieh Wu's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of the complexities involved in electronic design, paving the way for future advancements in technology.