Cheng-Chieh Hsu

Title: Cheng-Chieh Hsu: Innovator in Integrated Circuit Packaging

Introduction

Cheng-Chieh Hsu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit packaging, holding 2 patents that enhance heat dissipation in electronic devices. His innovative designs aim to improve the efficiency and reliability of electronic components.

Latest Patents

Hsu's latest patents include a dual-sided heat dissipating structure for integrated circuit packages. This design features a step-shaped first heat dissipating member that adheres to the active side of the chip, along with a dish-shaped perforated second heat dissipating member on the non-active side. This configuration allows for more effective heat dissipation, preventing issues such as the pop corn effect during IR Reflow tests. Additionally, he has developed a thin enhanced TAB BGA package that incorporates an IC chip and a substrate with a center opening. This package is designed to be small and thin while maintaining effective heat dissipation, all produced at a low cost without the need for additional equipment.

Career Highlights

Cheng-Chieh Hsu has worked with First International Computer, Inc., where he applied his expertise in integrated circuit technology. His work has contributed to advancements in the design and manufacturing of electronic components, particularly in improving thermal management.

Collaborations

Hsu has collaborated with notable coworkers such as Tsung-Chieh Chen and Ken-Hsiung Hsu. Their combined efforts have led to innovative solutions in the field of electronics.

Conclusion

Cheng-Chieh Hsu's contributions to integrated circuit packaging demonstrate his commitment to innovation and efficiency in electronic design. His patents reflect a deep understanding of thermal management, which is crucial for the performance of modern electronic devices.