Other

First International Computer, Inc.

Cheng-Chieh Hsu

Tsung-Chieh Chen

Yi-Liang Peng

Ken-Hsiung Hsu

A dual-sided heat dissipating structure for BGA package includes a step-shaped first heat dissipating member adhering to an active side of the chip and a dish-shaped perforated second heat dissipating member adhering to a non-active side of the chip so that heat generated in the chip may be dissipated more effectively. The step surface first heat dissipating member may also serve as a press mold to enable bonding of inner leads of the substrate to the bonding pads of the chip be done along with adhering of the first heat dissipating member to the chip at same process in the mean time without additional process or equipment. The perforated second heat dissipating member enables moisture escaping from the package to avoid pop corn effect resulting from IR Reflow test. The package may be made at a thin thickness and low cost.

Dual-sided heat dissipating structure for integrated circuit package

A thin enhanced TAB BGA package includes an IC chip, a substrate having a center opening and one side laid with a metallic circuitry which has a plurality of inner leads extending to the center opening, a plurality of metallic solder balls attached to the substrate at one side and coupling with the metallic circuitry, and a heat dissipating member adhering partly to the a side of the chip and partly to the substrate for heat dissipating, positioning and supporting the IC chip and the substrate. The IC chip has a another side exposed to ambience to add heat dissipating effect. The heat dissipating member has about same thickness as the substrate. Hence the ball grid array package may be made of a small size and thin thickness. The adhering of heat dissipating member to the chip and substrate may be done at the same process of bonding the inner leads to the IC chip. Thus the thin enhanced TAB BGA package of this invention may be produced at low cost without additional equipment or process.

Growing community of inventors

Hsinchu, Taiwan

Cheng-Chieh Hsu