Taipei, Taiwan

Cheng Chi Lee

This inventor holds 1 USPTO granted patent. Top assignee: Hon Hai Precision Industry Co., Ltd.. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng Chi Lee. Retrieved from https://idiyas.com/inventor/cheng-chi-lee-z1691e2u

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2005

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Cheng Chi Lee: Innovator in Heat Sink Technology

Introduction

Cheng Chi Lee is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of thermal management through his innovative designs. His work primarily focuses on enhancing the efficiency of heat sinks, which are crucial components in various electronic devices.

Latest Patents

Cheng Chi Lee holds a patent for a heat sink base. This invention features a rectangular body made of aluminum and a circular core made of copper. The design includes a circular through opening, with a diameter slightly less than that of the core. The core is securely attached within the body through a series of precise steps, ensuring optimal performance and durability.

Career Highlights

Cheng Chi Lee is associated with Hon Hai Precision Industry Co., Ltd., a leading company in the electronics manufacturing sector. His role at the company has allowed him to apply his innovative ideas in practical applications, contributing to the advancement of technology in the industry.

Collaborations

Cheng has collaborated with talented coworkers, including Xue Jin Fu and Zheng Liu. Their combined expertise has fostered a creative environment that encourages the development of cutting-edge solutions in thermal management.

Conclusion

Cheng Chi Lee's contributions to heat sink technology exemplify the importance of innovation in the electronics industry. His patent and collaborative efforts highlight his commitment to improving thermal efficiency in electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…