Chu-Dung, Taiwan

Cheng-Chi Hsieh


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: **Cheng-Chi Hsieh: Innovator in Wafer Pressure Regulation Systems**

Introduction

Cheng-Chi Hsieh is a notable inventor based in Chu-Dung, Taiwan, recognized for his contributions to the field of semiconductor manufacturing. His innovative work has led to the development of a unique patent that enhances the efficiency and effectiveness of polishing machines used in wafer processing.

Latest Patents

Cheng-Chi Hsieh holds a patent for a "Wafer Pressure Regulation System for Polishing Machine." This invention provides a controlled pressure regulation system that generates necessary wafer-pressing pressures during polishing operations. The wafer carrier head is designed to hold the wafer securely against a platen while employing a first and second pressure regulator that generates distinct pressing pressures. These regulators are crucial for maintaining the desired pressure differential, enhancing the polishing process's precision and quality.

Career Highlights

Hsieh is currently associated with United Microelectronics Corporation, a prominent player in the semiconductor industry. His role in the company involves collaboration with cutting-edge technology aimed at improving manufacturing processes. His expertise in engineering and innovative mindset have contributed to advancements that benefit the entire industry.

Collaborations

Throughout his career, Cheng-Chi Hsieh has worked closely with fellow innovators, including Chien-Hsin Lai and Jung-Nan Tseng. These collaborations have fostered an environment of creativity and ingenuity, allowing for the development of groundbreaking technologies that address industry challenges.

Conclusion

Cheng-Chi Hsieh’s commitment to innovation in wafer processing technology has made significant impacts in semiconductor manufacturing. His patent for the wafer pressure regulation system exemplifies his ability to blend practical engineering solutions with advanced technology, promising to enhance the quality of wafer polishing processes in the industry. As he continues to work at United Microelectronics Corporation, his contributions are sure to shape the future of semiconductor innovations.

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