Cheng Cheng

Title: Cheng Cheng - Innovator in Tungsten Feature Formation

Introduction

Cheng Cheng is a notable inventor based in San Jose, CA (US). He has made significant contributions to the field of semiconductor manufacturing, particularly in the formation of low resistivity tungsten features. His innovative methods have the potential to enhance the performance of electronic devices.

Latest Patents

Cheng Cheng holds 1 patent for his work titled "Methods for forming low resistivity tungsten features." This patent describes a method of forming a structure on a substrate that includes a tungsten-containing layer. The process involves the use of a nucleation layer and a fill layer, where the nucleation layer contains boron and tungsten. The resulting tungsten-containing layer achieves a resistivity of about 16 μΩ·cm or less, with a specific thickness that optimizes its performance.

Career Highlights

Cheng Cheng is currently employed at Applied Materials, Inc., a leading company in the semiconductor industry. His work focuses on developing advanced materials and processes that improve the efficiency and effectiveness of semiconductor devices. His expertise in tungsten feature formation has positioned him as a valuable asset in his field.

Collaborations

Cheng collaborates with talented individuals such as Peiqi Wang and Kai Wu. These partnerships foster innovation and contribute to the advancement of technology in semiconductor manufacturing.

Conclusion

Cheng Cheng's contributions to the field of semiconductor technology through his innovative methods for forming low resistivity tungsten features highlight his role as a key inventor. His work continues to influence the industry and pave the way for future advancements.