Taipei, Taiwan

Cheng-Chan Wu

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Chicony Power Technology Co., Ltd.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng-Chan Wu. Retrieved from https://idiyas.com/inventor/cheng-chan-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Cheng-Chan Wu: Innovator in Power Supply Technology

Introduction

Cheng-Chan Wu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of power supply technology. His innovative designs have led to the development of a unique connector structure that enhances the efficiency of power supply devices.

Latest Patents

Cheng-Chan Wu holds a patent for a "Hybrid type wire-to-wire connector structure and power supply device having the same." This invention includes a power supply housing with an accommodating space and an accommodating opening. The hybrid wire-to-wire connector structure consists of a connecting seat and an adapter seat, which simplifies the assembly of power and signal connectors.

Career Highlights

Cheng-Chan Wu is currently employed at Chicony Power Technology Co., Ltd. His work focuses on advancing power supply solutions that integrate both power and signal connections. This integration is crucial for improving the overall efficiency of electronic devices.

Collaborations

Cheng-Chan Wu collaborates with talented coworkers, including Chao-Yi Huang and Hung-Chieh Lin. Their combined expertise contributes to the innovative projects at Chicony Power Technology Co., Ltd.

Conclusion

Cheng-Chan Wu's contributions to power supply technology exemplify the importance of innovation in modern electronics. His patented designs not only enhance functionality but also streamline manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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