Chen-Wei Tseng

Title: Innovations by Inventor Chen-Wei Tseng in Heat Dissipation Technology

Introduction: Chen-Wei Tseng, an accomplished inventor based in New Taipei, Taiwan, has made significant contributions to the field of electronics with his innovative designs and manufacturing methods. With three patents to his name, Tseng’s work focuses on advanced heat dissipation substrates and package structures, which are crucial in modern electronic devices.

Latest Patents: Tseng's latest patents reflect his commitment to enhancing thermal management in electronic components. His first patent describes a "Structure and manufacturing method of heat dissipation substrate and package structure." This invention features a multilayer circuit board that includes a core board and build-up boards, along with a heat conduction layer and cavity structure. The design allows for effective heat flow distribution, ensuring that heat is managed efficiently from bonding pads through vias to the heat conduction layer.

Another notable patent by Chen-Wei Tseng is the "Chip package circuit board module." This innovative module incorporates a circuit board that contains multiple pads strategically placed to accommodate at least one original chip. Tseng’s design ensures that the width of the pads in relation to the original chip optimizes the functionality and connectivity, enhancing overall performance.

Career Highlights: Throughout his career, Tseng has built a strong reputation in the field of electronics. He currently works for Unimicron Technology Corporation, a leader in providing advanced electronic solutions. Tseng’s technical expertise has positioned him as a valuable asset in the innovation space, contributing to the company's success and reputation for excellence in product development.

Collaborations: Collaboration is a hallmark of innovation, and Tseng has had the opportunity to work alongside notable colleagues such as Wen-Fang Liu and Shao-Chien Lee. Together, they have fostered a creative environment conducive to developing groundbreaking technologies in electronic components, pushing the boundaries of what is possible in the industry.

Conclusion: Chen-Wei Tseng stands out as a pivotal figure in the development of innovative heat dissipation technologies. With his proven track record of patents and a collaborative spirit, Tseng continues to make vital contributions to the electronics industry, paving the way for future advancements and setting new standards in thermal management solutions.