Chen-Sheng Lin

Title: Innovations of Chen-Sheng Lin in Three-Dimensional Packaging

Introduction

Chen-Sheng Lin is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative methods for creating three-dimensional packages. His work is essential in advancing the technology used in modern electronics.

Latest Patents

Chen-Sheng Lin holds a patent for a "Method and structure for a three-dimensional package." This patent includes methods of forming three-dimensional packages and the resulting structures. The invention utilizes a bridge die to electrically connect one die to another die and at least one additional die adjacent to the bridge die. The height-to-width ratio of the gap between the bridge die and the additional die is controlled by thinning the bridge die to be thinner than the additional die. Furthermore, the packages may utilize landing structures to adjoin a dielectric material of an attached die to a metallic landing structure of a base die. This innovative approach enhances the efficiency and performance of semiconductor devices.

Career Highlights

Chen-Sheng Lin is currently employed at Taiwan Semiconductor Manufacturing Co., Ltd. His role at this leading semiconductor company allows him to apply his expertise in packaging technology. His contributions have been instrumental in the development of advanced semiconductor solutions.

Collaborations

One of his notable coworkers is Min-Chien Hsiao. Their collaboration in the field of semiconductor packaging has led to advancements that benefit the industry.

Conclusion

Chen-Sheng Lin's innovative work in three-dimensional packaging exemplifies the importance of creativity and technical expertise in the semiconductor industry. His contributions continue to influence the development of modern electronic devices.