Company Filing History:
Years Active: 2016
Title: Innovations of Chen-Ning Fu in Semiconductor Technology
Introduction
Chen-Ning Fu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in chip packaging. His innovative approach has led to the development of a unique chip package that enhances the functionality and efficiency of semiconductor devices.
Latest Patents
Chen-Ning Fu holds 1 patent for his invention titled "Chip package and method thereof." This patent describes a chip package that includes a semiconductor chip, an interposer, a polymer adhesive supporting layer, a redistribution layer, and a packaging layer. The semiconductor chip features a sensor device and a conductive pad that is electrically connected to the sensing device. The interposer is strategically placed on the semiconductor chip, containing a trench and a through hole that expose portions of the sensing device and the conductive pad, respectively. The polymer adhesive supporting layer is interposed between the semiconductor chip and the interposer, while the redistribution layer is positioned on the interposer and in the through hole to establish an electrical connection with the conductive pad. The packaging layer encapsulates the interposer and the redistribution layer, featuring an opening that exposes the trench.
Career Highlights
Chen-Ning Fu is currently employed at Xintec Corporation, where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing chip packaging technologies, which are crucial for the performance of modern electronic devices.
Collaborations
Throughout his career, Chen-Ning Fu has collaborated with talented individuals such as Chien-Min Lin and Yu-Ting Huang. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Chen-Ning Fu's contributions to semiconductor technology, particularly through his innovative chip package design, highlight his role as a leading inventor in the field. His work at Xintec Corporation and collaborations with other professionals continue to drive advancements in this critical area of technology.