Company Filing History:
Years Active: 2021-2023
Title: Innovations of Chen-Hua Cheng
Introduction
Chen-Hua Cheng is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of chip packaging and circuit board technology. With a total of 3 patents to his name, his work has had a considerable impact on the electronics industry.
Latest Patents
One of his latest patents is a manufacturing method of the chip package structure that includes at least one chip and at least one thermally conductive element. This innovative chip package structure comprises a molding compound and a redistribution layer, ensuring efficient thermal management and electrical connectivity. Another significant patent is related to a circuit board structure that includes multiple sub-circuit boards, designed to enhance electrical connections and improve overall performance.
Career Highlights
Chen-Hua Cheng is currently employed at Unimicron Technology Corporation, where he continues to develop cutting-edge technologies. His expertise in chip packaging and circuit board design has positioned him as a key player in the industry.
Collaborations
Throughout his career, Chen-Hua Cheng has collaborated with esteemed colleagues such as John Hon-Shing Lau and Tzyy-Jang Tseng. These partnerships have fostered innovation and contributed to the advancement of technology in their field.
Conclusion
In summary, Chen-Hua Cheng is a distinguished inventor whose work in chip packaging and circuit board technology has led to multiple patents and significant advancements in the electronics industry. His contributions continue to shape the future of technology.