Taoyuan, Taiwan

Chen-Hao Chan

This inventor holds 1 USPTO granted patent. Top assignee: Nexcom International Co., Ltd.. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chen-Hao Chan. Retrieved from https://idiyas.com/inventor/chen-hao-chan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Chen-Hao Chan and Server Cooling Innovation.

Introduction

Chen-Hao Chan is an inventor associated with Taoyuan, Taiwan, and Nexcom International Co., Ltd. His patent work includes a design for improving heat dissipation in a server box body.

Latest Patents

Chan is credited with 1 patent: “Heat dissipating assembly for a server box body.” The invention describes a grid plate positioned across the center of a server enclosure, with fans in air-absorbing portions on one side and main boards and heat-dissipating plates on the other. A clearance between the grid plate and a partition forms a heat concentration area. Hot air from the boards and heat-dissipating plates flows into this area, where the fans draw it out of the enclosure.

Career Highlights

The available information connects Chan’s invention to server thermal management and identifies Nexcom International Co., Ltd. as his company. The patent’s design focuses on directing hot air toward a concentrated area for removal, supporting heat dissipation within the server enclosure.

Collaborations

Hsiang-Chan Chen is identified as Chan’s coworker. The available details do not specify a particular role for the coworker in the patent.

Conclusion

Chen-Hao Chan’s patent presents a server-cooling arrangement that channels heat toward fans for removal, reflecting his contribution to thermal management technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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