Hsinchu, Taiwan

Chen Han Ping


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: Innovations of Chen Han Ping in Semiconductor Manufacturing

Introduction

Chen Han Ping is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative patent. His work is essential in advancing technology in this highly competitive industry.

Latest Patents

Chen Han Ping holds a patent for a self-aligned dual damascene method. This method is designed for fabricating an interconnection between a conductive line and a via plug on an insulating layer. The process involves several steps, including forming a conductive line pattern on the insulating layer, etching the upper part of the insulating layer, and forming conductive line spacers. These spacers enhance alignment between the conductive line and the via, improving control over small vias and ensuring better metal coverage during the filling process. The method culminates in filling the conductive line opening and the via hole with a conductive material, establishing a reliable interconnection.

Career Highlights

Chen Han Ping is currently employed at TSMC-Acer Semiconductor Manufacturing Corporation. His role at this prestigious company allows him to apply his innovative ideas and contribute to the advancement of semiconductor technologies. His expertise and dedication have made him a valuable asset to his team.

Collaborations

Chen has collaborated with notable colleagues, including Wu Kuo Chien and Chen Hsi Chieh. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Chen Han Ping's contributions to semiconductor manufacturing through his innovative patent demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and inspire future innovations.

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