The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2002
Filed:
Oct. 15, 1999
TSMC-ACER Semiconductor Manufacturing Corporation, Hsinchu, TW;
Abstract
A method for fabricating an interconnection between a conductive line and a via plug on an insulating layer, comprises the steps of: forming a conductive line pattern on the insulating layer; etching the upper part of the insulating layer and forming a conductive line opening; forming conductive line spacers to provide better alignment between the conductive line and the via, to provide better control of a small via, and to help the metal to have better coverage effects in filling in the conductive line opening and the via; producing a via pattern on the insulating layer and the via pattern opening being substantially larger than the conductive line opening; etching the exposed lower part of the insulating layer by utilizing the conductive line spacers as an etching mask and forming a via hole; and filling the conductive line opening and the via hole with a conductive material and forming an interconnection of the conductive line and a via plug.