Company Filing History:
Years Active: 2002
Title: Chen Chin-Te: Innovator in Semiconductor Bonding Technology
Introduction
Chen Chin-Te is a notable inventor based in Tunshau, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly in the area of wire bonding technology. His innovative approach has led to the development of a unique patent that addresses critical challenges in the bonding process.
Latest Patents
Chen Chin-Te holds a patent for a "System and method for detecting bonding status of bonding wire of semiconductor package." This invention provides schemes associated with the wire bonding process or wire bonding machine to detect the bonding status of a bonding wire in a package that includes at least a semiconductor unit. The patent is particularly beneficial for Ball Grid Array (BGA) packages and similar types, offering significant advantages in scenarios where the resistance between a semiconductor unit and its carrier is not sufficiently low. The invention establishes a preset connection between the semiconductor unit and the package-connection-area at the beginning of the wire bonding process, allowing for the detection of bonding status through a current loop formed during the bonding process.
Career Highlights
Chen Chin-Te is currently employed at Siliconware Precision Industries, Ltd., a leading company in the semiconductor packaging industry. His work focuses on enhancing the reliability and efficiency of semiconductor packages through innovative bonding techniques. His contributions have been instrumental in advancing the technology used in modern semiconductor manufacturing.
Collaborations
Chen collaborates with Lee Ming-Hsun, a coworker who shares his commitment to innovation in semiconductor technology. Together, they work on projects that aim to improve the performance and reliability of semiconductor packages.
Conclusion
Chen Chin-Te's innovative work in semiconductor bonding technology exemplifies the importance of advancements in this field. His patent not only addresses existing challenges but also paves the way for future developments in semiconductor packaging.