Chehan Jerry Li

Title: Chehan Jerry Li: Semiconductor Packaging Inventor

Introduction

Chehan Jerry Li is an inventor associated with Taichung, Taiwan. His patent work concerns semiconductor packaging, particularly molded interconnection substrates for system-in-package devices. The available information lists 1 patent and identifies Dialog Semiconductor (UK) Limited as his company.

Latest Patents

Li’s listed patent is “Integrated Type MIS Substrate for Thin Double Side SIP Package.” It describes a molded interconnection substrate with redistribution layers and components mounted on opposite sides. One or more active or passive components are embedded in molding compound on one side, while another component is placed in a cavity on the opposite side. The redistribution layers provide electrical connections between the components, and solder balls connect to the layers through openings to provide package outputs.

Career Highlights

The patent reflects work on compact, double-sided system-in-package designs. By integrating components and electrical connections within a molded substrate, the described approach addresses the structure of thin semiconductor packages. Li is associated with Dialog Semiconductor (UK) Limited.

Collaborations

The provided information names Jesus Mennen Belonio, Jr. and Shou-Cheng Eric Hu as Li’s coworkers. Their inclusion indicates professional connections, though no specific joint patent or collaboration details were provided.

Conclusion

Chehan Jerry Li’s listed invention focuses on integrating components and redistribution layers into a thin, double-sided system-in-package substrate, highlighting his connection to semiconductor packaging innovation.