This inventor holds 1 USPTO granted patent. Top assignee: Lumileds Singapore Pte. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chee Teong Lim and Semiconductor Packaging Innovation.
Introduction
Chee Teong Lim is an inventor based in Bayan Lepas, Malaysia, associated with Lumileds Singapore Pte. Ltd. His patent work concerns semiconductor device structures and manufacturing methods.
Latest Patents
Lim is named on 1 patent: “Semiconductor Structure and Methods of Manufacturing the Same.” The invention describes electrically connecting a semiconductor device to a power source through an electrical contact and one or more bumps. In one example, the device is an LED on a CMOS wafer, with the electrical contact positioned apart from the LED. Side coating material surrounds the device and contact, while stacked bumps can extend to or near the coating’s top surface, with their upper surfaces exposed.
Career Highlights
The available information identifies Lim’s work with Lumileds Singapore Pte. Ltd. and highlights his contribution to semiconductor structure and manufacturing technology.
Collaborations
Lim’s listed coworkers include Chee Jong Loh and Grigoriy Basin.
Conclusion
Chee Teong Lim’s recorded patent focuses on semiconductor device connections and packaging, including bump and side-coating arrangements that support electrical integration.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile