Chee Mun Wai

Title: Chee Mun Wai: Semiconductor Packaging Inventor

Introduction

Chee Mun Wai is an inventor associated with Infineon Technologies AG. His patent work includes a semiconductor packaging method that uses a structured leadframe with metal posts.

Latest Patents

The provided information identifies one patent associated with Chee Mun Wai: “Semiconductor Package with Metal Posts from Structured Leadframe.” The method begins with a metal baseplate comprising a planar base section and multiple posts extending upward from its surface. A semiconductor die is mounted on the baseplate, and an insulating mold compound forms an encapsulant around the assembly. The die’s terminals are electrically connected to the metal posts. Removing the base section then leaves the posts as package contacts at the encapsulant’s surface. The record lists 1 patent.

Career Highlights

Chee Mun Wai’s listed patent illustrates work on semiconductor packaging, particularly the formation of package contacts from metal posts in a structured leadframe. The provided information associates him with Infineon Technologies AG.

Collaborations

The listed coworkers are Sock Chien Tey and Keck Tim Ang. The information provided does not specify their roles in the patent or their working relationship with Chee Mun Wai.

Conclusion

Chee Mun Wai’s identified patent focuses on a semiconductor package design that forms contacts from metal posts after removal of the leadframe’s base section, reflecting his documented contribution to semiconductor packaging innovation.