This inventor holds 1 USPTO granted patent. Top assignee: Institute of Microelectronics. Active years: 2004.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2004
Title: Chee Chong Wong - Innovator in Integrated Circuit Manufacturing
Introduction
Chee Chong Wong is a notable inventor based in Singapore, recognized for his contributions to the field of integrated circuit manufacturing. He has developed innovative methods that enhance the efficiency and effectiveness of semiconductor fabrication processes. His work has significant implications for the electronics industry.
Latest Patents
Wong holds a patent for a residue-free solder bumping process. This innovative method involves fabricating solder bumps in the manufacture of integrated circuit devices. The process includes providing contact pads over a semiconductor substrate, followed by a passivation layer that has openings exposing the top surface of the contact pads. A sacrificial layer is then deposited, which is not wettable to solder. Under bump metallurgy (UBM) caps can be formed through various methods, including selective electroless deposition. An aperture mask is used to create openings for the solder layer, which is printed and reflowed to form solder bumps. The removal of the sacrificial layer ensures that all residue from the aperture mask is eliminated, completing the solder bump formation.
Career Highlights
Chee Chong Wong is affiliated with the Institute of Microelectronics, where he continues to advance research in semiconductor technologies. His work has led to significant improvements in the manufacturing processes of integrated circuits, making them more efficient and reliable.
Collaborations
Wong collaborates with Gautham Viswanadam, working together to push the boundaries of innovation in their field. Their partnership exemplifies the importance of teamwork in achieving groundbreaking advancements in technology.
Conclusion
Chee Chong Wong's contributions to the field of integrated circuit manufacturing through his patented solder bumping process highlight his role as an influential inventor. His work not only enhances manufacturing efficiency but also sets a foundation for future innovations in semiconductor technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile