Che-yen Huang

Title: Innovations by Che-yen Huang in Semiconductor Technology

Introduction

Che-yen Huang is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor structure that enhances performance and efficiency.

Latest Patents

Che-yen Huang holds a patent for a semiconductor structure and semiconductor device. The patent discloses a semiconductor structure that includes a top die and a bottom die, with the maximum die size constrained to reticle dimensions. Each die comprises several components, including core computation circuits, analog circuits connecting to memory, output elements, a serial high-speed analog circuit, an intra-stack connection circuit, and cache memory. This design aims to achieve high wafer yield with minimal tape-out masks, resulting in cost savings. The intra-stack connection circuit connects the top and bottom dies over a short distance of about tens of micrometers, ensuring high signal quality and power efficiency.

Career Highlights

Che-yen Huang is currently associated with Seriphy Technology Corporation, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices.

Collaborations

Some of his notable coworkers include Tzu-wei Chiu and Chun-Wei Chang, who contribute to the collaborative efforts in their projects.

Conclusion

Che-yen Huang's contributions to semiconductor technology exemplify the impact of innovative thinking in the field. His patent reflects a commitment to enhancing device performance and efficiency, marking him as a significant figure in the industry.