Changhua, Taiwan

Che-Tseng Lin

This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Industrial Technology Research Institute. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Che-Tseng Lin. Retrieved from https://idiyas.com/inventor/che-tseng-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Che-Tseng Lin: Innovator in Copolyester and Foam Material

Introduction

Che-Tseng Lin is an inventor based in Changhua, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of copolyester and foam materials. His innovative approach focuses on the unique properties of polyester elastomers and their applications.

Latest Patent Applications

Che-Tseng Lin's latest patent application involves a copolyester formed by reacting 100 parts by weight of a polyester elastomer with 0.01 to 0.29 parts by weight of a compound having multi-functional groups. The polyester elastomer is created by reacting polyethylene terephthalate, diol, and poly(alkylene ether) glycol. The weight ratio of polyethylene terephthalate to diol is maintained between 1:0.6 to 1:3, while the ratio of polyethylene terephthalate to poly(alkylene ether) glycol is kept between 1:0.05 to 1:3. This innovative formulation aims to enhance the properties of foam materials.

Conclusion

Che-Tseng Lin's work in copolyester and foam material showcases his dedication to advancing material science. His innovative patent application reflects his commitment to developing new materials with enhanced properties.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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