Kensington, MD, United States of America

Charles Stouffer




Average Co-Inventor Count = 3.1

ph-index = 2

Forward Citations = 25(Granted Patents)


Company Filing History:


Years Active: 2007-2010

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2 patents (USPTO):Explore Patents

Title: The Innovations of Charles Stouffer

Introduction

Charles Stouffer is an accomplished inventor based in Kensington, MD (US). He holds a total of 2 patents that showcase his expertise in engineering and design. His work has significantly contributed to advancements in heat transfer systems and metal bonding processes.

Latest Patents

Stouffer's latest patents include an "Evaporator for use in a heat transfer system." This innovative evaporator features a cylindrical barrier wall and a cap that fits at one end, designed to enhance efficiency in heat transfer applications. The cylindrical barrier wall defines a central axial opening and an outer cylindrical surface, with a liquid port extending through the outer surface.

Another notable patent is for "High temperature isostatic pressure bonding of hollow beryllium pressure vessels using a bonding flange." This process involves bonding metal parts to create seamless, hollow articles, particularly from beryllium. The method utilizes hot isostatic pressing at high temperatures and pressures, resulting in strong, homogeneous materials ideal for space flight applications.

Career Highlights

Throughout his career, Stouffer has worked with reputable companies such as Alliant Techsystems Inc. and Swales & Associates, Inc. His contributions to these organizations have been instrumental in developing innovative technologies.

Collaborations

Stouffer has collaborated with talented individuals like Dmitry Khrustalev and Pete Cologer. These partnerships have fostered a creative environment that has led to significant advancements in their respective fields.

Conclusion

Charles Stouffer's contributions to innovation through his patents and collaborations highlight his expertise and dedication to engineering. His work continues to influence advancements in heat transfer systems and metal bonding processes.

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