Company Filing History:
Years Active: 2000-2002
Title: The Innovative Contributions of Charles Ouellet
Introduction
Charles Ouellet is a notable inventor based in Missisquoi, Canada. He has made significant contributions to the field of integrated circuit technology. With a total of 3 patents to his name, Ouellet's work has had a substantial impact on the industry.
Latest Patents
One of Ouellet's latest patents is focused on a method for forming a flip-chip-on-board assembly. This invention involves an integrated circuit (IC) chip that features a polyimide passivation layer. The chip is joined to a chip carrier using multiple solder bumps, which connect the contact pads on the IC chip to corresponding contacts on the chip carrier. A space is created between the passivation layer and the chip carrier's surface. Ouellet's method employs plasma treatment to chemically modify the surfaces of both the chip carrier and the IC chip's passivation layer without roughening it. The plasma used can be either an O plasma or a microwave-generated Ar and N O plasma. An underfill encapsulant material is then applied to fill the created space, enhancing adhesion between the encapsulant and both the IC chip and the chip carrier.
Career Highlights
Ouellet is currently associated with the International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of integrated circuits and their applications in various electronic devices.
Collaborations
Throughout his career, Ouellet has collaborated with notable colleagues, including Jean Dery and Frank Daniel Egitto. These partnerships have contributed to the successful development of his innovative projects.
Conclusion
Charles Ouellet's contributions to the field of integrated circuits exemplify the spirit of innovation. His patents and ongoing work at IBM continue to shape the future of technology.