This inventor holds 2 USPTO granted patents. Top assignee: Texas Instruments Corporation. Active years: 1978-2000.
Company Filing History:
Years Active: 1978-2000
Title: Innovations of Charles M. Hess
Introduction
Charles M. Hess is a notable inventor based in Dallas, TX, who has made significant contributions to the field of integrated circuit packaging. With a total of 2 patents, his work focuses on enhancing the efficiency and functionality of shipping systems for electronic devices.
Latest Patents
Hess's latest patents include a "Multi-functional shipping system for integrated circuit devices." This invention describes a multifunctional shipping container designed specifically for integrated circuits. The container, which features foam inserts, is dimensioned to securely ship and store integrated circuits in either tray or reel format. Its expandable cavity allows for ease of access during loading and unloading at multiple workstations. This innovative design supports the shipping process from the tray or reel supplier to the IC assembly and test site, ultimately benefiting distribution centers and customers by eliminating multiple costs associated with disposal, inventory, and new shipping materials.
Another significant patent is the "Package for multielement electro-optical devices." This semiconductor device package includes a base structure, a cover, and an environmental seal. The cover is secured with screws to the base structure and sealed at the interface to provide an environmentally protected package. The design allows for a stress-free package, which is crucial for maintaining the integrity of the electro-optical device during shipping and handling.
Career Highlights
Charles M. Hess is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His work at Texas Instruments has allowed him to focus on innovative solutions that enhance the performance and reliability of electronic devices.
Collaborations
Throughout his career, Hess has collaborated with notable colleagues, including Clessie A. Troxtell, Jr. and Laura A. Hnilo. These collaborations have contributed to the development of advanced technologies in the field of integrated circuits.
Conclusion
Charles M. Hess's contributions to the field of integrated circuit packaging through his innovative patents demonstrate his commitment to advancing technology. His work continues to impact the efficiency of shipping systems for electronic devices, showcasing the importance of innovation in the semiconductor industry.