Vestal, NY, United States of America

Charles H Dando, Iii

USPTO Granted Patents = 3 

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 44(Granted Patents)


Location History:

  • Vestal, NY (US) (2010 - 2011)
  • Endicott, NY (US) (2016)

Company Filing History:


Years Active: 2010-2016

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3 patents (USPTO):

Title: Inventor Spotlight: Charles H. Dando, III

Introduction

Charles H. Dando, III, a notable inventor based in Vestal, NY, holds multiple patents that contribute significantly to the field of thermal management in electronics. With three registered patents, Dando's innovative designs focus on enhancing the efficiency of heat transfer in various applications.

Latest Patents

One of Dando's recent patents is for an "Efficient Heat Transfer from Conduction-Cooled Circuit Cards." This invention features a conduction-cooling frame that incorporates a printed wiring board and a wedgelock fastener. The frame is designed with a thermal management interface to effectively transfer heat from the frame to a chassis. Notably, the thermal management interface employs different materials to enhance its efficiency, ensuring optimal performance for electronic components.

Another significant patent Dando developed is a "High Performance Large Tolerance Heat Sink." This apparatus provides a heat sink with a deformable, convex foil construction that can accommodate the specific requirements of electronic components. Its design enables deformation upon contact, improving the heat dissipation capabilities critical for maintaining optimal temperatures in electronic systems.

Career Highlights

Charles H. Dando, III contributes his expertise through his position at Lockheed Martin Corporation, a leading aerospace and defense company that supports technological innovations. His work primarily revolves around improving electronic systems’ thermal management, addressing critical challenges in heat dissipation for advanced electronics.

Collaborations

In his professional journey, Dando has collaborated with talented colleagues such as Jon Larcheveque and David Luverne Vos. These collaborations often lead to innovative solutions and enhancements in electronic component design, showcasing the power of teamwork in driving technological advancements.

Conclusion

With his impactful patents and collaborative spirit, Charles H. Dando, III exemplifies the essence of innovation in the field of thermal management. His work at Lockheed Martin Corporation not only reinforces the importance of efficient heat transfer but also highlights the role of inventors in pushing the boundaries of technology. As we look to the future, Dando’s contributions will undoubtedly inspire further innovations in the realm of electronics.

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