Lockheed Martin Corporation

Charles H Dando, Iii

Randall Joseph Stutzman

David Luverne Vos

Stephen Gonya

William E Murphy

Jon Larcheveque

Clint Long

A conduction-cooled card assembly is disclosed that includes a conduction-cooling frame, a printed wiring board mounted on the frame, and a wedgelock fastener. The conduction-cooling frame has a thermal management interface adapted to transfer heat from the frame to a chassis, and the wedgelock fastener is adapted to press the thermal management interface of the conduction-cooling frame against a rail of the chassis. The assembly also has one or more of the following characteristics: (a) the thermal management interface of the conduction-cooling frame is made primarily of a first material and a portion of the thermal management interface that is adapted to engage the wedgelock fastener or the rail of the chassis is made of a second material that is softer than the first material, and (b) the wedgelock fastener is made primarily of a first material and a portion of the wedgelock fastener that is adapted to engage the thermal management interface or another rail of the chassis is made of a second material that is softer than the first material. A chassis for conduction-cooled card assemblies is also disclosed which comprises a housing and at least first and second rails within the housing that are adapted to receive a conduction-cooled card assembly therebetween. At least one of the first and second rails is made primarily of a first material and has a surface portion made of a second material that is softer than the first material.

Efficient heat transfer from conduction-cooled circuit cards

A heat sink apparatus for electronic components provides a heat sink and a deformable, convex foil construction affixed to the heat sink around a periphery of the foil construction and adapted to extend away from the heat sink to enable deformation of the convex foil construction as a result of contact with a top surface of an electronic component mounted opposite the foil construction.

High performance large tolerance heat sink

A method and product which provides a thin metal or ceramic plate to the top of a plastic grid array (PGA) as a stiffener to maintain its flatness over temperature during a column attach process, and the columns are used for attachment to circuit boards or other circuit devices. These may be constructed in this manner initially or may be retrofitted plastic ball grid arrays from which the solder balls are removed and, the stiffener is attached to the top, and the solder columns have been added to replace the solder balls. The stiffener is a bonded thin metal or ceramic plate attached to the top of the PGA to maintain its flatness over temperature during the column attach process. An aluminum plate bonded to the top of a PGA results in a significant reduction in warping during a temperature cycle. This allows attachment of solder columns to the PBGA. The high melt solder columns are attached to an area array pattern on the PBGA substrate. This array is typically either a solid or perimeter grid. It is critical that the ends of the solder columns opposite the ends attached to the substrate align precisely with the matching grid of solder pads on the printed wiring board. The purpose of the stiffening plate is to maintain the flatness of the PBGA during the process of attaching the columns to the substrate as well as attaching the component to the printed wiring board such that the columns maintain their alignment over this temperature range.

Growing community of inventors

Vestal, NY, United States of America

Charles H Dando, Iii