Apple Valley, MN, United States of America

Charles H A Smith

This inventor holds 1 USPTO granted patent. Top assignee: Seagate Technology Incorporated. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Charles H A Smith. Retrieved from https://idiyas.com/inventor/charles-h-a-smith

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Charles H. A. Smith and Static-Dissipative Connector Design.

Introduction

Charles H. A. Smith is an inventor associated with Apple Valley, Minnesota, and Seagate Technology Incorporated. His listed patent concerns an electrical connector housing designed to dissipate static charges while maintaining electrical insulation during normal operation.

Latest Patents

Smith is credited with 1 patent, titled “Static Dissipative Shunt Housing.” The invention describes an electrical connector with a housing made from a near-insulative material. Its surface resistivity allows enough current to dissipate static electrical charges, while limiting current flow under low-voltage conditions during ordinary signal or power transmission. The design aims to reduce the risk of damaging a microchip when a jumper is placed onto a set of pins.

Career Highlights

Smith’s listed patent reflects work on connector materials and electrostatic-discharge protection. The housing is intended to drain static charge to a level that helps prevent a connected microchip from failing during jumper installation.

Collaborations

Smith’s listed coworkers include Scott Douglas Ulrich and Ron F. Parson. The available information identifies these professional associations but does not specify their roles in the patent.

Conclusion

Charles H. A. Smith’s patent addresses a practical electronics challenge by combining static-charge dissipation with insulation for normal connector operation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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