Charles F Horejs, Jr

Title: The Innovations of Charles F Horejs, Jr.

Introduction

Charles F Horejs, Jr. is a notable inventor based in Morgan Hill, California. He has made significant contributions to the field of integrated circuit technology, holding a total of nine patents. His work focuses on enhancing the durability and functionality of smart cards and similar devices.

Latest Patents

One of Horejs' latest patents is for a "Reinforced Micromodule." This invention features a reinforcement structure designed to protect an integrated circuit module located within a card-type data carrier or smart card. The structure is rigid and has a modulus of elasticity that exceeds that of the smart card, ensuring better protection for the integrated circuit. It includes a cavity for housing the integrated circuit module and can be constructed from thermally and electrically conductive materials. Another significant patent is for a "Plastic Integrated Circuit Card with an Enclosed Reinforcement Structure." This design completely surrounds the integrated circuit module with a reinforcement structure, relieving stress during bending and torsion of the card.

Career Highlights

Horejs has worked with several companies throughout his career, including Us3, Inc. and Us.sup.3, Inc. His innovative designs have contributed to advancements in smart card technology, making them more robust and reliable.

Collaborations

Some of his notable coworkers include Thomas H Templeton, Jr. and Thomas B Templeton. Their collaborative efforts have likely played a role in the development of his patented technologies.

Conclusion

Charles F Horejs, Jr. is a distinguished inventor whose work has significantly impacted the field of integrated circuit technology. His innovative patents continue to enhance the functionality and durability of smart cards, showcasing his expertise and dedication to advancing technology.