San Jose, CA, United States of America

Charles Bailley


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

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2 patents (USPTO):Explore Patents

Title: The Innovations of Charles Bailley

Introduction

Charles Bailley is a notable inventor based in San Jose, CA. He has made significant contributions to the field of electronics, particularly in the development of advanced electronic packages. With a total of 2 patents to his name, Bailley's work is recognized for its innovative approach to integrating heat management in electronic devices.

Latest Patents

One of Bailley's latest patents focuses on electronic packages with integral heat spreaders. This invention includes a substrate and a first gallium nitride (GaN) transistor formed on a first semiconductor die that is electrically coupled to the substrate. Additionally, a second GaN transistor is formed on a second semiconductor die and is also electrically coupled to the substrate. An integral heat spreader is thermally coupled to both gallium nitride semiconductor dies and is electrically connected to the substrate. This design allows for efficient application of bias voltages to both GaN transistors via the integral heat spreader, enhancing the performance of electronic devices.

Career Highlights

Charles Bailley is currently employed at Navitas Semiconductor Limited, where he continues to push the boundaries of electronic innovation. His work has been instrumental in advancing the capabilities of semiconductor technology, particularly in the realm of power electronics.

Collaborations

Bailley has collaborated with notable colleagues such as George Chu and Daniel Marvin Kinzer. Their combined expertise has contributed to the successful development of innovative technologies in the semiconductor industry.

Conclusion

Charles Bailley's contributions to the field of electronics, particularly through his patents and work at Navitas Semiconductor Limited, highlight his role as a key innovator in the industry. His advancements in electronic packages with integral heat spreaders demonstrate the importance of effective heat management in modern electronic devices.

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