Quebec, Canada

Charbel Matta

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Ciena Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Charbel Matta. Retrieved from https://idiyas.com/inventor/charbel-matta

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Charbel Matta and Signal Transmission Between Integrated Circuit Device Planes.

Introduction

Charbel Matta is an inventor associated with Quebec, Canada, and Ciena Corporation. His patent work addresses the transmission of electromagnetic signals across an interface transition region between integrated circuit device planes.

Latest Patents

Matta is credited with 1 patent: “Transmitting Electromagnetic Signals Over an Interface Transition Region Between Integrated Circuit Device Planes.” The invention describes an apparatus with a first interface using edge-coupled coplanar striplines and a second interface using edge-coupled striplines. A transition structure connects conductors across the interfaces, with at least part of the structure using broad-side coupled conductors. The design provides a way to carry electromagnetic signals through the transition between the device planes.

Career Highlights

Matta’s listed patent reflects work on signal transmission and interconnect structures for integrated circuit devices. He is associated with Ciena Corporation, a company known for communications technology.

Collaborations

Matta’s listed coworkers include Maxime Jacques and Gregory Brookes. The patent’s technical subject concerns coordinated conductor structures that connect two interfaces through a transition region.

Conclusion

Charbel Matta’s patent focuses on an interconnect design for transmitting electromagnetic signals between integrated circuit device planes, highlighting his contribution to communications and electronic systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…