Company Filing History:
Years Active: 2025
Title: Chao Xie: Innovator in Copper-Copper Bonding Technology
Introduction
Chao Xie is a notable inventor based in Hefei, China. He has made significant contributions to the field of three-dimensional packaging technology. His innovative work focuses on bonding methods for copper-copper metals, which are essential in various electronic applications.
Latest Patents
Chao Xie holds a patent for a bonding method for copper-copper metal using hydrazine hydrate. This method involves pretreating a copper-plated surface of a clean copper-plated substrate under a protective atmosphere. The process maintains the copper-plated surface at temperatures between 50° C. to 90° C. Subsequently, multiple copper-plated substrates are subjected to pressurized bonding at temperatures ranging from 200° C. to 300° C. This innovative approach enhances the reliability and efficiency of copper bonding in electronic devices. He has 1 patent to his name.
Career Highlights
Chao Xie is affiliated with Anhui University, where he continues to advance research in materials science and engineering. His work has garnered attention for its practical applications in the electronics industry.
Collaborations
Chao collaborates with esteemed colleagues such as Wenhua Yang and Xin Huang. Their combined expertise contributes to the advancement of innovative technologies in their field.
Conclusion
Chao Xie's contributions to the bonding methods for copper-copper metals represent a significant advancement in the field of three-dimensional packaging technology. His innovative approach and collaboration with fellow researchers continue to drive progress in this essential area of electronics.