This inventor holds 1 USPTO granted patent. Top assignee: Huawei Digital Power Technologies Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chao Shen and Embedded Power Packaging
Introduction
Chao Shen is an inventor based in Shanghai, China, associated with Huawei Digital Power Technologies Co., Ltd. His patent work addresses embedded packaging and power-supply design, with a focus on reducing device size and supporting integration.
Latest Patents
Shen is named on one patent, 1 patent: “Embedded Package Structure and Power Supply Apparatus.” The application describes stacking smaller electronic components and arranging them in a substrate frame alongside a larger inductor. This configuration can reduce the package’s occupied area and overall size, supporting miniaturization and integration. A chip is placed on the package surface, positioning the main heat source at the surface of the power-supply apparatus.
Career Highlights
Shen’s listed patent reflects work on compact power-electronics packaging. The design combines component stacking and two-dimensional placement to make more efficient use of space.
Collaborations
Chunyan Zhao and Kuanming Bao are identified as Shen’s coworkers.
Conclusion
Chao Shen’s patent describes an embedded package structure intended to make power-supply apparatuses more compact and easier to integrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile