Company Filing History:
Years Active: 2016
Title: Innovations by Chao Kun Lin in Eutectic Bonding Processes
Introduction
Chao Kun Lin is an accomplished inventor based in San Jose, CA. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of eutectic bonding processes. His innovative approach has the potential to reduce manufacturing costs while enhancing the performance of electronic devices.
Latest Patents
Chao Kun Lin holds a patent for a non-reactive barrier metal for the eutectic bonding process. This patent describes a eutectic metal layer, such as gold/tin, that bonds a carrier wafer structure to a device wafer structure. The device wafer structure includes a silicon substrate with an epitaxial LED structure. A layer of silver is placed on the epitaxial LED structure, while the carrier wafer structure consists of a conductive silicon substrate covered with an adhesion layer. A layer of non-reactive barrier metal, such as titanium, is positioned between the silver layer and the eutectic metal to prevent diffusion of metal from the eutectic layer into the silver during wafer bonding. This process is conducted at temperatures exceeding 280°C for more than one minute. The use of the non-reactive barrier metal layer allows for a reduction in the amount of expensive platinum used in the manufacture of vertical blue LEDs on silicon, thereby lowering manufacturing costs.
Career Highlights
Chao Kun Lin is currently associated with Manutius IP, Inc., where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the efficiency and cost-effectiveness of LED manufacturing processes.
Conclusion
Chao Kun Lin's contributions to the field of eutectic bonding processes exemplify the impact of innovative thinking in semiconductor manufacturing. His patented technology not only enhances device performance but also significantly reduces production costs.