Bangkok, Thailand

Chanidapa Tangjitwatanakorn

This inventor holds 1 USPTO granted patent. Top assignee: Western Digital Technologies, Inc.. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chanidapa Tangjitwatanakorn. Retrieved from https://idiyas.com/inventor/chanidapa-tangjitwatanakorn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 21(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Chanidapa Tangjitwatanakorn: Disk Drive Manufacturing Innovation.

Introduction

Chanidapa Tangjitwatanakorn is an inventor based in Bangkok, Thailand, associated with Western Digital Technologies, Inc. His patent work addresses a method for manufacturing a disk drive.

Latest Patents

The provided information lists one patent for Tangjitwatanakorn: “Method of Manufacturing a Disk Drive Using a Media Cover.” The method describes installing at least one disk in a base and temporarily coupling a media cover to the base. A head, actuator arm, and voice coil motor are then installed. The media cover is removed, and a head disk assembly cover is coupled to the base to complete the assembly. Tangjitwatanakorn is credited with 1 patent in the supplied data.

Career Highlights

Tangjitwatanakorn’s listed patent concerns a manufacturing sequence for assembling a disk drive while using a media cover during part of the process. The supplied information associates his work with Western Digital Technologies, Inc.

Collaborations

The provided data names Pranee Thonghara and Suwan Trongjitwikrai as coworkers. It does not specify their roles in the patent or describe particular collaborations.

Conclusion

Chanidapa Tangjitwatanakorn’s listed invention focuses on a disk drive assembly method that uses a temporary media cover during manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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