Cupertino, CA, United States of America

Changhun Lee

This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Changhun Lee. Retrieved from https://idiyas.com/inventor/changhun-lee-mb83z8be

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:

goldMedal1 out of 834,513 
Other
 patents

Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Changhun Lee: Innovator in Interconnect Line Fabrication

Introduction

Changhun Lee is a notable inventor based in Cupertino, CA. He has made significant contributions to the field of semiconductor fabrication, particularly through his innovative methods.

Latest Patents

Changhun Lee holds a patent for a "Method for fabricating an interconnect line." This method involves forming a wall, depositing an etch mask with a thickness that decreases towards the bottom of the wall, and isotropically etching the wall at the bottom. The result is an interconnect line that has a predetermined gap between the substrate and the bottom of the line. He has 1 patent to his name.

Career Highlights

Throughout his career, Changhun Lee has demonstrated a commitment to advancing technology in the semiconductor industry. His work has been instrumental in improving the efficiency and effectiveness of interconnect line fabrication.

Collaborations

Changhun has collaborated with talented individuals such as Ajay Kumar and Chan-syun David Yang, contributing to a dynamic work environment that fosters innovation.

Conclusion

Changhun Lee's contributions to the field of semiconductor fabrication highlight his role as an influential inventor. His innovative methods continue to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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